With the quick growth of electronics industry, on the printed circuit board (PCB) of the welding procedure and welding quality requirements larger and larger. Previous thermal curing and UV curing resists are utilizing display printing of graphics. Comprehensive coverage from the line, size precision, think about making use of silk screen graphic approaches have been incompatible, so the researchers created a dry movie resist. But the dry film resist because of its inherent limitations, can not entirely meet the performance specifications of PCB, even though technically its resolving energy can reach virtually 25 m, but the scale is the actual manufacturing can be 75 ~ 100 m. The growth of electronic technological innovation, has asked the resolving electrical power of substantial-density PCB on the forefront of the 75 m, and will be created to 50 m, or even fine lines. For that reason, the urgent require for new photoresist, the resolving electrical power to a increased level, especially at the board’s inner board manufacturing. In addition, PCB price tag competition, are getting to be more and more fierce, forcing producers to ensure that the PCB PCB high quality and performance of the premise, do everything possible to decrease the PCB manufacturing fees. Dry movie resist according to their framework traits, its expense is challenging to decrease. In addition, the high-density PCB pad area essential to lessen, or even a “no” pads, dry film resist is challenging to adapt to this kind of a request. For that reason, several PCB companies to shift interest to the liquid photoresist [one ~ five].
Existing a new generation of liquid photoresist is an outstanding representative of the liquid photosensitive imaging inks (also acknowledged as moist-movie resist) and the electrodeposition liquid photoresist (ED resist). Resist employing these new, effortless to get large resolution. For illustration, the typical source of non-alignment and common imaging gadgets, imaging obtained after the resolution of 50 m. The use of a collimated light supply, as prolonged as the clean setting and make certain the suitable base map circumstances, the resolving energy of up to 25 m. Outer or inner layer in the subsequent etching procedure, as in contrast with the dry film, liquid photoresist etching can give excellent final results. This higher resolution permits fine line PCB manufacturers can generate extremely lower defect density of the product, and higher yield.
Photosensitive resist ink is a liquid solution designed for fine wire drawing manufacturing of a printing ink, frequently identified as the moist film. It overcomes the thermosetting resist ink and dry manufacturing approach in a number of difficulties for fine wire and fine wire production. The most thin broad attain in 2. 54mm centered between the two pads 3 wires (. 125mm) or four wires (. 075mm), can also be utilized for substantial-precision craft, stencil mask, gravure printing production functions, can be utilized to make multilayer inner layer of fine wire. It consists of photosensitive resin, photosensitive agents, fillers, additives, pigments and solvents. Ink resolution up to 50 ~ 100 m, and good adhesion of copper clad board, there does not exist in the dry movie manufacturing arising from the edge of the interface of bubble diffusion coating thereby causing the wire spikes, gaps, brief circuit and other Defects. Ink is generally yellow light area in the security context of the managing, storage of about one year. Liquid photo plating resist ink of a quick technical operation procedures are as follows:
Pre-drying coating cooling exposure Imaging elimination of ink curing plating post-processing etching
Liquid photosensitive resist leakage can use display printing, spraying or curtain coating, and so on. as a full webpage on the PCB coating with no orientation, by pre-heating, the surface is dry, the application of ultraviolet camera bottom plate positioning exposure, improvement and entry to correct corrosion graphics. With the classic sizzling reliable, light solid and corrosion resistance compared to dry, very first of all graphics and higher precision can be simply obtained by forty ~ 50 m in the solder joints graphics other and the substrate and the copper wire with very good heat resistance, high gap in the wire is filled with very good, defective price Also, because of its use as thermosetting epoxy resin composition, it is chemical resistance, plating resistance, humidity, heat and electrical insulation are extremely good. In see of these benefits, foreign production of high precision multi-layer circuit boards and circuit boards have been using the liquid photosensitive resist.
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